Gecko Ultra offers a novel way to keep all kinds of seeds, kernels and decorative toppings safely attached to dough pieces. The innovative new product scores with its high powers of adhesion, effectively minimizing the loss of toppings – which often consist of expensive ingredients – throughout the whole production and transport process.
Thus, consumers receive baked goods with immaculate decors that are more pleasing to consume, while manufacturers are able to reduce their cleaning and maintenance costs. Gecko Ultra is a Clean Label product. Easy to use, the granulate is mixed with 10 parts water. The resulting suspension can be applied automatically via roller, spray or immersion systems. Alternatively, it can be brushed onto dough pieces manually.
Gecko Ultra is based on wheat flour and is manufactured using physical processes only. A special refining method gives the product its outstanding adhesive properties.
Seeded dough pieces treated with Gecko Ultra are able to withstand the mechanical stresses of processing virtually undamaged. This represents a great advantage over the commonly used methods of attaching toppings to dough, which are – depending on the system in question – treatment with water or water-guar mixes. As well as reducing wastage of expensive ingredients during production, Kampffmeyer Food Innovation’s new product also leads to improved industrial hygiene, which means less time spent on cleaning and maintaining production plants. With regard to end products, the adhesive power of Gecko Ultra ensures that baked goods are able to withstand packing and transportation processes. Gecko Ultra can be used with all baked goods which are coated with seeds or other toppings, from bread and bread rolls to pastries.
Trials undertaken with technology providers Danmatic und Spraying Systems Co. show that Gecko Ultra can be used with all established plant machinery. Should customers require assistance, Kampffmeyer Food Innovation is on hand, along with the technology providers, to offer support and answer questions about using the seed adhesive, as well as implementation of additional modules alongside existing equipment.
