Confectionery company, The Hershey Company (Hershey’s), has announced that it has entered into a multi-year joint venture development agreement with 3D printing company 3D Systems to explore opportunities for using 3D printing technology in creating edible foods, including confectionery treats.
Hershey’s and 3D Systems said the alliance would combine Hershey’s “world-class food science and manufacturing expertise” with 3D Systems’ 3D printing technology and know-how “to deliver new consumer experiences”.
“We believe that innovation is key to delivering relevant, compelling consumer experiences with our iconic brands,” said William Papa, Vice President and Chief Research and Development Officer, Hershey’s. “Whether it’s creating a whole new form of candy or developing a new way of producing it, we embrace new technologies such as 3D printing as a way to keep moving our timeless confectionery treats into the future,” he said.
3D Systems is a global provider of 3D printing centric design-to-manufacturing solutions including 3D printers, print materials and cloud sourced on-demand custom parts for professionals and consumers. It works with materials including plastics, metals, ceramics and edibles.
“Mainstreaming 3D printing is fundamental to our success and we are fortunate to partner with Hershey, the largest producer of quality chocolate in North America and a global leader in chocolate and confection to expand the 3D printing experience to delectable edibles,” said Chuck Hill, Chief Technology Officer, 3D Systems.
3D Systems showcase confectionery printer at trade show
The announcement of the partnership with Hershey’s came just after 3D Systems showcased the ChefJet 3D printer, designed to create custom confectionery, cake toppers and edible novelties, at the global consumer technology trade show International CES (CES).
The ChefJet will come in two formats — the ChefJet, which will deliver single-colour edible prints, and the ChefJet Pro, which will deliver full colour prints. The Company said the printers will be available later in 2014.
